* Molded Parts
* Sintered Diamond Abrasion (PCD) Resistance Parts
* Various processing (cemented carbide, Ceramic, difficult-to-cut product, resin)
* Metal Parts for Semiconductors
* Metal Parts for Aerospace and Airplane
* Equipment Design and Assembly
* Bonding tools
* Nozzle and Collet
* Nano-Machining products
* Various coatings
* Laser-Weld Cladding
* Inspection, Analysis, Measurement (3D Image Measurement, SEM)
Nakayama Seimitsu Kougu was established and specializing in the manufacture of abrasion resistance parts for semiconductor electronics.
Increase capital stock to 4 million yen.
Increase capital stock to 12 million yen.
-New factory begins operations at Nishihara-mura, Kumamoto,
in accordance with “Kumamoto-Prefecture Technopolis Project”.
-Start production of precision parts of semiconductor and metallic die
Increase capital stock to 24 million yen.
2nd building is completed in Kumamoto factory and begins operations.
The company name is changed to Nakayama Seimitsu Co., Ltd.
3rd building is completed in Kumamoto factory and begins operations.
Opens Tokyo branch in Kawasaki-city, Kanagawa.
Integrated Osaka factory with Kumamoto factory.
2nd plant is completed in Kumamoto and begins operations.
Moved Tokyo branch to present address.
The name of the branch changed to “Tokyo sales office”
Increase capital stock to 48 million yen.
Obtains ISO 14001 certification. (No.E1039)
Moves head office to present address.
Obtains ISO 9001 certification. (No.3854)
3rd plant is completed in Kumamoto and begins operations
Commence operations of ISO 9001, ISO 14001 Integrated Management System (JICQA).
Opens Nakayama (Shanghai) Co., Ltd.
-Opens Technical Center in Kikuyo, Kumamoto and begins operations.
-Moves sales division to technical center.
Moves Tokyo branch to present address and changes the name to "Yokohama branch".