Collets & Nozzles
We provide collets and nozzles, the core components of semiconductor manufacturing equipment (die bonders, dispensers). By applying a mirror finish (lapping) to the inner surface, we dramatically improve material fluidity, solving coating process issues such as "dripping" and "clogging." We can also manufacture hybrid types using different materials like resin, ceramic, or carbide at the tip.
Specifications & Scope
| Min. Inner Dia | φ0.01mm ~ (varies by aspect ratio) |
|---|---|
| Materials | Carbide, SUS, Ceramics, Ruby, Sapphire, Resins (PEEK, Vespel, etc.) |
| Key Tech | Inner mirror polishing, Tip R-shape, Micro-hole drilling |